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" Brunschwiler and other IBM researchers piped water into cooling structures as thin as a human hair (50 microns) between the individual chip layers to remove heat efficiently at the source. The 3-D chip stacks would have an aggregated heat dissipation of close to 1 kilowatt -- 10 times greater than the heat generated by a hot plate -- with an area of 4 square centimeters and a thickness of about 1 millimeter."